Qualcomm is expected to announce its flagship Snapdragon 8 Gen 2 chipset at its annual summit that’s taking place between November 15-17 and we expect all the major Android OEMs to bring devices with it soon after. A new series of leaked specs from tipster Digital Chat Station suggest we’ll see the upcoming flagship chipset on the Honor Magic5.
The device will also reportedly feature a
curved high refresh rate 6.8-inch display with PWM dimming. In terms of
cameras, Magic5 will bring a 50MP main shooter with AI ISP tuning. The flagship
will also offer an IP-68 rating for water and dust resistance and blazing-fast
100W wired and 50W wireless charging.
In related spec leaks news, DCS also
reports of a new foldable phone from Honor that’s also expected to use the
Snapdragon 8 Gen 2 chipset and 66W wired charging.
