MediaTek is expected to announce a lower variant of its newly unveiled Dimensity 9000 SoC. This upcoming chipset is said to go official as Dimensity 7000. Ahead of that, the General Manager of the Redmi brand teases this silicon.
A couple of days back, Redmi GM Lu Weibing
teased the yet-to-be-announced Dimensity 7000 chip on Weibo by questioning what
kind of processor it is. This clearly suggests that there will be Redmi
smartphones powered by this SoC as the executive is known for vague teasers.
Although the Xiaomi group exec doesn’t hint at the device, we can speculate it
to be the recently spotted Xiaomi Rubens (L11A), which is expected to house the
unreleased MediaTek silicon. Currently, there’s only a Chinese variant of this
phone with model number 22041211AC.
As of now, we only know that the handset
will feature a triple camera array on the rear. This setup will include a 64MP
Samsung ISOCELL GW3 primary sensor. As far as the marketing name is concerned,
it is rumored to go official as Redmi K50 Gaming Standard Edition. While the
Xiaomi Matisse (L10) with a MediaTek Dimensity 9000 is said to release as Redmi
K50 Gaming Pro.
We look forward to learning more about
Xiaomi Rubens before its launch via certifications, leaks, and teasers in the
coming days.
