As
February nears and Samsung’s Unpacked event is just three weeks away the leaks
surrounding the Galaxy Z Flip are giving us a clearer picture of what to expect
from Samsung's second foldable phone.
A new Twitter post from Max Weinbach who
previously revealed details about the S20 lineup is giving us a much better
picture of the Z Flip's hardware package. Starting with the display, we are
getting a Dynamic AMOLED panel covered with Ultra Thing Glass (UTG) and it will
apparently feature a crease at the folding point. This is to be expected with
foldable devices but the UTG solution should be far more durable than the
Galaxy Fold's plastic.
The
phone will also come with a side-mounted capacitive fingerprint scanner.
Weinbach also shares the device will run on the Snapdragon 855+ chipset instead
of the previously rumored Snapdragon 855.
The Z
Flip will come with two 12MP shooters on the back which are revealed to be
regular (wide) and ultrawide modules. Wired charging speeds are confirmed at
15W, there’s also wireless and reverse wireless capabilities but we don’t get
info on their charging speeds.
