Honor is gearing up to unveil its first ever flip foldable smartphone soon. The upcoming clamshell folding device was previously spotted in a rumor, and now, a fresh leak has revealed the launch timeline and design for the Magic Flip.
In an earlier report, we covered a leak
that suggested that the Magic Flip will be released in China’s Spring Festival.
This has now been backed by the same tipster on Weibo (a Chinese microblogging
website) again. For those unaware, the Spring Festival in China will be hosted
between the 10th and 17th of February 2024. Apart from this, the tipster also
shared an image, which offers us a look at the new flip phone.
The leaked picture showcases the rear
design of the Magic Flip with two circular ring modules. The top module likely
houses the image sensors, while the lower one would sport the external cover
display. So the design appears to be quite similar to clamshell folding phones
from its former parent company, Huawei. Based on what we know so far, the Magic
Flip is powered by a 4,500mAh battery pack, which consists of a 2,420mAh +
1,980mAh dual-cell battery.
Unfortunately, this is all the information
we have at the moment. Keep in mind that this is still just an unconfirmed report,
so take this news with a pinch of salt for now and stick around for more as we
will be providing updates when additional details are available regarding this
device.
