A schematic of vivo’s new X Flip foldable clamshell has been revealed by tipster Digital Chat Station. This is the Chinese phone maker’s first clamshell foldable that’s expected to be packing the Snapdragon 8+ Gen 1 chipset. The X Flip is expected to arrive to the Chinese market sometime in early 2023.
The X flip will feature an external
rectangular display, and it sits below a multi-camera cutout. A mockup
illustration (seemingly photo-chopped from renders of other vivo) of the X Flip
shows a four-camera setup, triple LED flash, and Zeiss branding for the camera,
though the latter two are yet to be confirmed. All we know from the alleged
schematic is that the camera cutout will be round.
We can speculate that perhaps there will
be either two or three cameras and an LED flash all within the same circular
cutout for the cameras. Plus, the use of Zeiss branding would be an interesting
choice by vivo, as clamshell foldables from competitors don’t typically excel
in photography as well as their flagship counterparts do.
We don’t know much more about the mystery
clamshell foldable. Just earlier today, the same tipster revealed the bit about
the X Flip equipping a Snapdragon 8+ Gen 1, but that’s as much as has been
revealed.
