We’re all set to cover the nubia Red Magic 7 announcement on February 17 but before the big event nubia posted several new teasers for its upcoming gaming flagship. Red Magic 7 will bring an all-new independent gaming chipset dubbed Red Core No. 1. Based on the teaser the chip will process sound, light, vibration and touch inputs.
The new teasers also detailed the phone’s
elaborate heat dissipation system via a teardown video as well as several new
posters. Red Magic 7 will bring a multi-stage cooling system with a 20,000 RPM
active cooling fan featuring enhanced air pressure and airflow with reduced
noise compared to the outgoing Red Magic 6 series.
The phone will also house the largest-ever
VC cooling plate covering a total area of 41,279mm² - 30% larger than its
predecessor. In addition, nubia will offer a separate active cooling case. Red
Magic 7 will also be the first gaming phone with an under-display camera but we
did not get details if all versions will come with the fancy new UD cam nor
what resolution the image sensor is.
In more related news, Red Magic 7 appeared
in a Geekbench listing and was also certified by the Wi-Fi Alliance. The
Geekbench listing yet again confirms the Red Magic 7 will bring Qualcomm’s
Snapdragon 8 Gen 1 chipset. We can also see the version in the test (NX709J)
brings 16GB RAM and boots Android 12.
It managed a respectable 1,264-points in
the single-core department and 3,744-points on the multi-core test. The Wi-Fi
Alliance confirms the device will bring dual-band Wi-Fi- connectivity and
Android 12.
