LG had previously announced the LG Velvet
back in this year packing in a Snapdragon 765G chipset. Lately, T-Mobile had
announced that it will be bringing the LG Velvet 5G to the United States with a
MediaTek Dimensity 1000C chipset instead of the Snapdragon 765G. Interestingly,
the Velvet 5G with new chipset is spotted on Geekbench with 6GB of RAM. The
phone scores a score of 601 in the single-core test and 2365 points in the
multi-core test.
This time around, the LG Velvet will be
sporting a chipset from MediaTek. According to Google Play Console, the phone
will sport the MediaTek’s Dimensity 800 processor. This is a 7nm Octa-Core
processor with an integrated modem for 5G connectivity. The chipset makes use
of four Cortex-A76 cores clocked at 2.0GHz and four Cortex-A55 cores working at
2.0GHz rate. For graphical purposes, this system-on-chip comes with a Mali-G77
MC4 GPU. MediaTek also equipped it with HyperEngine gaming technology ensuring
a smooth gaming experience. The listing also suggests that the processor is
paired with the 6G of RAM. If you recall, the vanilla LG Velvet came with a
sole 8GB of RAM option. The phone runs Android 10 OS straight out of the box
with LG UX on top.
Apart from the chipset, the phone may
retain the design and other specs of the Qualcomm variants. This will include
the 6.9-inch P-OLED display with 2,460 x 1080 pixels of resolution and a 20.5:9
aspect ratio. The phone also comes with a waterdrop notch at the top housing a
16MP selfie snapper. The display offers support for stylus (Wacom) input with
up to 4,096 pressure levels. Unfortunately, this display is of the 60Hz
standard. The device has a well-designed raindrop triple-camera setup. It packs
a 48MP primary camera, an 8MP ultra-wide sensor, and a 5MP depth shooter.
The Dimensity 800 variant would be cheaper
than the Snapdragon 765G which currently starts at 650 Euros for the 8GB of
RAM. That’s way too much for this chipset. In addition to the cheaper
processor, we also expect to see 6GB RAM bringing the price to a lower point.
