The retail packaging of Xiaomi’s upcoming Mi 8
flagship has leaked online. The low-cost Chinese brand has already confirmed
its plans to unveil the Xiaomi Mi 8 on May 31 and now, after a number of
previous leaks, what appears to be the device’s retail packaging has shown up,
revealing various design details in the process.
Overall, it appears Xiaomi’s next flagship will
resemble Apple’s iPhone X quite closely, sporting what seems to be a bezel-less
display complete with a notch up top. Additionally, this is rumored to house
new hardware that will allow for Face ID-rivalling 3D facial recognition,
making the Mi 8 the first smartphone to sport the tech. Unlike the iPhone X,
though, Xiaomi’s new flagship is expected to feature an in-display fingerprint
scanner too. Moving over to the rear of the smartphone, a vertical camera setup
adorns the glass build in the top-left corner, with this including two sensors
and what appears to be a dual-tone LED flash. Also, when looking at the frame,
Xiaomi has equipped the smartphone with an elongated volume rocker and a small
power button placed slightly below.
In regards to what hardware specifications the
Xiaomi Mi 8 will offer, Qualcomm’s Snapdragon 845 will power the smartphone,
coupled with either 6GB or 8GB of RAM. Additionally, 128GB of internal storage
will be on offer. On the software side of things, Android 8.1 Oreo will ship
straight out of the box with the MIUI 10 custom overlay on top.
Lastly, in terms of a release date and pricing, the
Xiaomi Mi 8 is expected to go on sale towards the beginning of June, with
pricing rumored to start at roughly US$ 470.
