VIA has announced the availability of its new VIA
Edge AI Developer Kit this week, which is now available to purchase in two
configurations from the VIA Embedded online store. The first configuration
consists of a VIA SOM-9X20 SOM Module and SOMDB2 Carrier Board with 13MP CMOS
Camera Module with specifications offering COB 1/3.06″ and a resolution of 4224
x 3136 pixels for US$ 629 plus shipping. The second consists of a VIA SOM-9X20 SOM
Module and SOMDB2 Carrier Board for US$ 569 plus shipping. There is also available
and optional 10.1″ MIPI LCD touch panel, costing US$ 179 plus shipping.
The VIA Edge AI Developer Kit combines the VIA
SOM-9X20 SOM Module and SOMDB2 Carrier Board with a 13MP camera module that is
optimised for intelligent real-time video capture, processing, and edge
analysis.
VIA have also announced that a Linux BSP based on
Yocto 2.0.3 is set to be released in June 2018, as soon as more information and
full specifications are released we will keep you up-to-date as always but for
now jump over to the official VIA for more information and purchasing options.
