It looks like
LeEco is still working on a new top of the line smartphone. The Chinese company
is said to outfit this upcoming device with Qualcomm's Snapdragon 835 chipset,
leaving absolutely no doubt about its high-end aspirations.
The images have surfaced in China today and they are
claimed to depict this new LeEco handset. If that's true, then it's obvious
that it will come with a dual-curved touchscreen.
It also seems to be very thin, and we can spot a USB
Type-C port on the bottom next to a speaker grille, but there's no 3.5mm
headset jack to be seen. Of course that could be placed on the top, but the
rumor says LeEco won't be bringing the analog jack
back in this phone.
The new LeEco flagship is reportedly going to arrive
in April with 6GB of RAM and 256GB of storage. Other specs haven't been leaked
yet, but if we are indeed just a few weeks away from its launch we expect to
hear much more about it soon.
